Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972244 | Marking semiconductor devices through a mount tape | Viraj A. Patwardhan, You Chye How, Tian Oon Goh, Soi Chong Low | 2005-12-06 |
| RE38789 | Semiconductor wafer having a bottom surface protective coating | Pai-Hsiang Kao, William Jeffrey Schaefer | 2005-09-06 |
| 6932136 | Post singulation die separation apparatus and method for bulk feeding operation | Ken Pham, Jaime A. Bayan, Cheol Han | 2005-08-23 |
| 6916688 | Apparatus and method for a wafer level chip scale package heat sink | Jaime A. Bayan | 2005-07-12 |
| 6900110 | Chip scale package with compliant leads | Hem Takiar | 2005-05-31 |
| 6900532 | Wafer level chip scale package | Hem Takiar | 2005-05-31 |