Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6936916 | Microelectronic assemblies and electronic devices including connection structures with multiple elongated members | William R. Stephenson | 2005-08-30 |
| 6913952 | Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages | Lee Teck Kheng, Steve Thummel | 2005-07-05 |
| 6914326 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Steven G. Thummel, Dana A. Stoddard +1 more | 2005-07-05 |
| 6870276 | Apparatus for supporting microelectronic substrates | William R. Stephenson | 2005-03-22 |