Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6914326 | Solder ball landpad design to improve laminate performance | Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2005-07-05 |
| 6889902 | Descriptor for identifying a defective die site and methods of formation | — | 2005-05-10 |