DS

Dana A. Stoddard

Micron: 1 patents #434 of 861Top 55%
📍 Boise, ID: #251 of 564 inventorsTop 45%
🗺 Idaho: #384 of 1,002 inventorsTop 40%
Overall (2005): #214,040 of 245,428Top 90%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6914326 Solder ball landpad design to improve laminate performance Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel +1 more 2005-07-05