Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6914326 | Solder ball landpad design to improve laminate performance | Brad D. Rumsey, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard +1 more | 2005-07-05 |
| 6899534 | Mold assembly for a package stack via bottom-leaded plastic (blp) packaging | — | 2005-05-31 |