Issued Patents 2005
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6939800 | Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures | Hong-Qiang Lu, Peter A. Burke | 2005-09-06 |
| 6935933 | Viscous electropolishing system | Valeriy Sukharev | 2005-08-30 |
| 6930056 | Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for integrated circuit structure | Wei-Jen Hsia | 2005-08-16 |
| 6905909 | Ultra low dielectric constant thin film | Hao Cui, Peter A. Burke | 2005-06-14 |
| 6884720 | Forming copper interconnects with Sn coatings | Hongqiang Lu, Byung Sung Kwak | 2005-04-26 |
| 6881664 | Process for planarizing upper surface of damascene wiring structure for integrated circuit structures | Richard Schinella, Zhihai Wang, Wei-Jen Hsia | 2005-04-19 |
| 6875693 | Via and metal line interface capable of reducing the incidence of electro-migration induced voids | Charles E. May | 2005-04-05 |
| 6858531 | Electro chemical mechanical polishing method | Mei Zhu | 2005-02-22 |