Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6930056 | Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for integrated circuit structure | Wilbur G. Catabay | 2005-08-16 |
| 6881664 | Process for planarizing upper surface of damascene wiring structure for integrated circuit structures | Wilbur G. Catabay, Richard Schinella, Zhihai Wang | 2005-04-19 |