Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6969636 | Semiconductor package with stress inhibiting intermediate mounting substrate | — | 2005-11-29 |
| 6909176 | Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate | Wen-chou Vincent Wang, Yuan-Liang Li | 2005-06-21 |
| 6882041 | Thermally enhanced metal capped BGA package | Eng-Chew Cheah | 2005-04-19 |