Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949404 | Flip chip package with warpage control | Don Fritz, Yuan-Liang Li | 2005-09-27 |
| 6909176 | Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate | Donald S. Fritz, Yuan-Liang Li | 2005-06-21 |
| 6882045 | Multi-chip module and method for forming and method for deplating defective capacitors | Thomas J. Massingill, Mark Thomas McCormack | 2005-04-19 |
| 6845184 | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2005-01-18 |