Issued Patents 2005
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964584 | Low impedance, high-power socket and method of using | Dong Zhong, David G. Figueroa, Jiangqi He | 2005-11-15 |
| 6949404 | Flip chip package with warpage control | Don Fritz, Wen-chou Vincent Wang | 2005-09-27 |
| 6948943 | Shunting arrangements to reduce high currents in grid array connectors | — | 2005-09-27 |
| 6920051 | Hybrid capacitor, circuit, and system | David G. Figueroa, Huong Do | 2005-07-19 |
| 6914334 | Circuit board with trace configuration for high-speed digital differential signaling | Jiangqi He, Dong Zhong, David G. Figueroa | 2005-07-05 |
| 6909176 | Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate | Wen-chou Vincent Wang, Donald S. Fritz | 2005-06-21 |
| 6907658 | Manufacturing methods for an electronic assembly with vertically connected capacitors | — | 2005-06-21 |
| 6900991 | Electronic assembly with sandwiched capacitors and methods of manufacture | Priyavadan R. Patel, Chee-Yee Chung, David G. Figueroa, Robert L. Sankman, Hong Xie +1 more | 2005-05-31 |
| 6897556 | I/O architecture for integrated circuit package | Jianqi He, Michael Walk | 2005-05-24 |
| 6888238 | Low warpage flip chip package solution-channel heat spreader | — | 2005-05-03 |
| 6870257 | Power delivery through a flex tape in decoupled I/O-power hybrid substrate | Dong Zhong, Jianggi He, Jung Kang | 2005-03-22 |
| 6841842 | Method and apparatus for electrical-optical packaging with capacitive DC shunts | — | 2005-01-11 |