Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6894229 | Mechanically enhanced package and method of making same | — | 2005-05-17 |
| 6882041 | Thermally enhanced metal capped BGA package | Donald S. Fritz | 2005-04-19 |
| 6858942 | Semiconductor package with improved thermal cycling performance, and method of forming same | SYDNEY ANDERSON | 2005-02-22 |