Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960306 | Low Cu percentages for reducing shorts in AlCu lines | Roy Iggulden, Padraic Shafer, Kwong Hon Wong, Michael Iwatake, Jay William Strane +4 more | 2005-11-01 |
| 6943114 | Integration scheme for metal gap fill, with fixed abrasive CMP | Peter Wrschka, Thomas Goebel | 2005-09-13 |
| 6866943 | Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level | Gerald Friese, Hans-Joachim Barth, Axel Brintzinger | 2005-03-15 |