Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960835 | Stress-relief layer for semiconductor applications | Erdem Kaltalioglu, Mark Hoinkis, Gerald Friese, Pak K. Leung | 2005-11-01 |
| 6949442 | Methods of forming MIM capacitors | Petra Felsner, Erdem Kaltalioglu, Gerald Friese | 2005-09-27 |
| 6908841 | Support structures for wirebond regions of contact pads over low modulus materials | Lloyd Burrell, Douglas W. Kemerer, Henry A. Nye, III, Emmanuel F. Crabbe, David F. Anderson +1 more | 2005-06-21 |
| 6893959 | Method to form selective cap layers on metal features with narrow spaces | — | 2005-05-17 |
| 6866943 | Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level | Gerald Friese, Werner Robl, Axel Brintzinger | 2005-03-15 |
| 6844245 | Method of preparing a self-passivating Cu laser fuse | — | 2005-01-18 |