Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943101 | Manufacturing of a corrosion protected interconnect on a substrate | — | 2005-09-13 |
| 6919264 | Method for the solder-stop structuring of elevations on wafers | Ingo Uhlendorf, Andre Schenk, Alexander Wollanke | 2005-07-19 |
| 6911390 | Fabrication method for an interconnect on a substrate | — | 2005-06-28 |
| 6888215 | Dual damascene anti-fuse with via before wire | Carl Radens | 2005-05-03 |
| 6882027 | Methods and apparatus for providing an antifuse function | Carl Radens, William R. Tonti | 2005-04-19 |
| 6866943 | Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level | Gerald Friese, Werner Robl, Hans-Joachim Barth | 2005-03-15 |