Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960831 | Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad | Kwong Hon Wong, Adreanne Kelly, Samuel McKnight | 2005-11-01 |
| 6908841 | Support structures for wirebond regions of contact pads over low modulus materials | Douglas W. Kemerer, Henry A. Nye, III, Hans-Joachim Barth, Emmanuel F. Crabbe, David F. Anderson +1 more | 2005-06-21 |