Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960831 | Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad | Lloyd Burrell, Kwong Hon Wong, Adreanne Kelly | 2005-11-01 |
| 6864578 | Internally reinforced bond pads | David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Hiromitsu Miyai +4 more | 2005-03-08 |