Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960306 | Low Cu percentages for reducing shorts in AlCu lines | Roy Iggulden, Padraic Shafer, Kwong Hon Wong, Michael Iwatake, Jay William Strane +4 more | 2005-11-01 |
| 6943114 | Integration scheme for metal gap fill, with fixed abrasive CMP | Peter Wrschka, Werner Robl | 2005-09-13 |