Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6921018 | Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array | Wayne J. Howell | 2005-07-26 |
| 6915795 | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof | Donald W. Brouillette, Robert F. Cook, Wayne J. Howell, Eric G. Liniger, Ronald L. Mendelson | 2005-07-12 |
| 6887126 | Wafer thickness control during backside grind | Donald W. Brouillette, Harold G. Linde, Michael S. Hibbs, Ronald L. Mendelson | 2005-05-03 |
| 6858941 | Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array | Wayne J. Howell | 2005-02-22 |
| 6838749 | Structures for increasing the critical temperature of superconductors | Kenneth A. Puzey | 2005-01-04 |