Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6915795 | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof | Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger | 2005-07-12 |
| 6887126 | Wafer thickness control during backside grind | Donald W. Brouillette, Thomas G. Ference, Harold G. Linde, Michael S. Hibbs | 2005-05-03 |