Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6915795 | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof | Robert F. Cook, Thomas G. Ference, Wayne J. Howell, Eric G. Liniger, Ronald L. Mendelson | 2005-07-12 |
| 6887126 | Wafer thickness control during backside grind | Thomas G. Ference, Harold G. Linde, Michael S. Hibbs, Ronald L. Mendelson | 2005-05-03 |
| 6888223 | Use of photoresist in substrate vias during backside grind | Joseph Danaher, Timothy C. Krywanczyk, Amye L. Wells | 2005-05-03 |