Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6875688 | Method for reactive ion etch processing of a dual damascene structure | William G. America | 2005-04-05 |