Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6903013 | Method to fill a trench and tunnel by using ALD seed layer and electroless plating | Lap Chan, Sanford Chu, Chit Hwei Ng, Jia Zhen Zheng | 2005-06-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6903013 | Method to fill a trench and tunnel by using ALD seed layer and electroless plating | Lap Chan, Sanford Chu, Chit Hwei Ng, Jia Zhen Zheng | 2005-06-07 |