Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6936922 | Semiconductor package structure reducing warpage and manufacturing method thereof | Sung Soon Park, Sang Jae Jang, Seon Goo Lee, Eun Sook Sohn, Sung Su Park | 2005-08-30 |
| 6927483 | Semiconductor package exhibiting efficient lead placement | Sun Goo Lee, Sang Ho Lee | 2005-08-09 |
| 6879034 | Semiconductor package including low temperature co-fired ceramic substrate | Jun Yang, Sun Goo Lee | 2005-04-12 |
| 6876068 | Semiconductor package with increased number of input and output pins | Donald C. Foster, Jeoung Kyu Choi, Wan-Jong Kim, Kyong Hoon Youn, Sang Ho Lee +1 more | 2005-04-05 |
| 6867071 | Leadframe including corner leads and semiconductor package using same | Sung Sik Jang, Su Yol Yoo | 2005-03-15 |