Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867071 | Leadframe including corner leads and semiconductor package using same | Choon Heung Lee, Su Yol Yoo | 2005-03-15 |
| 6853059 | Semiconductor package having improved adhesiveness and ground bonding | — | 2005-02-08 |