Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6936922 | Semiconductor package structure reducing warpage and manufacturing method thereof | Sung Soon Park, Sang Jae Jang, Choon Heung Lee, Seon Goo Lee, Sung Su Park | 2005-08-30 |