Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927483 | Semiconductor package exhibiting efficient lead placement | Choon Heung Lee, Sang Ho Lee | 2005-08-09 |
| 6879034 | Semiconductor package including low temperature co-fired ceramic substrate | Jun Yang, Choon Heung Lee | 2005-04-12 |
| 6876068 | Semiconductor package with increased number of input and output pins | Choon Heung Lee, Donald C. Foster, Jeoung Kyu Choi, Wan-Jong Kim, Kyong Hoon Youn +1 more | 2005-04-05 |