Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6902870 | Patterning of dielectric with added layers of materials aside from photoresist for enhanced pattern transfer | Kay Hellig | 2005-06-07 |
| 6893956 | Barrier layer for a copper metallization layer including a low-k dielectric | Hartmut Ruelke, Joerg Hohage, Thomas Werner | 2005-05-17 |