Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6893956 | Barrier layer for a copper metallization layer including a low-k dielectric | Hartmut Ruelke, Thomas Werner, Massud Aminpur | 2005-05-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6893956 | Barrier layer for a copper metallization layer including a low-k dielectric | Hartmut Ruelke, Thomas Werner, Massud Aminpur | 2005-05-17 |