Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958247 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process | Gerd Marxsen, Axel Preusse, Frank Mauersberger | 2005-10-25 |
| 6951816 | Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst | Axel Preusse | 2005-10-04 |