Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958247 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process | Gerd Marxsen, Axel Preusse, Markus Nopper | 2005-10-25 |