Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974530 | Method and system for controlling ion distribution during plating of a metal on a workpiece surface | Matthias Bonkass | 2005-12-13 |
| 6958247 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process | Gerd Marxsen, Markus Nopper, Frank Mauersberger | 2005-10-25 |
| 6951816 | Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst | Markus Nopper | 2005-10-04 |
| 6841056 | Apparatus and method for treating a substrate electrochemically while reducing metal corrosion | — | 2005-01-11 |