Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828511 | Prefabricated semiconductor chip carrier | Maria M. Portuondo | 2004-12-07 |
| 6803650 | Semiconductor die package having mesh power and ground planes | Myoung-soo Jeon, Charley T. Ogata, Ton-Yong Wang, Andreas Cangellaris, Jose Schutt-Aine | 2004-10-12 |
| 6797882 | Die package for connection to a substrate | Myoung-soo Jeon, Charley T. Ogata | 2004-09-28 |
| 6734546 | Micro grid array semiconductor die package | Vicente D. Alcaria, Myoung-soo Jeon | 2004-05-11 |
| 6700138 | Modular semiconductor die package and method of manufacturing thereof | Jennifer Colegrove, Zsolt Horvath, Myoung-soo Jeon, Joshua G. Nickel, Lei Yang | 2004-03-02 |
| 6679733 | Electrical connector having electrically conductive shielding | Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link | 2004-01-20 |