Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803650 | Semiconductor die package having mesh power and ground planes | Stanford W. Crane, Jr., Myoung-soo Jeon, Charley T. Ogata, Ton-Yong Wang, Andreas Cangellaris | 2004-10-12 |