Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803650 | Semiconductor die package having mesh power and ground planes | Stanford W. Crane, Jr., Myoung-soo Jeon, Ton-Yong Wang, Andreas Cangellaris, Jose Schutt-Aine | 2004-10-12 |
| 6797882 | Die package for connection to a substrate | Stanford W. Crane, Jr., Myoung-soo Jeon | 2004-09-28 |