Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803650 | Semiconductor die package having mesh power and ground planes | Stanford W. Crane, Jr., Charley T. Ogata, Ton-Yong Wang, Andreas Cangellaris, Jose Schutt-Aine | 2004-10-12 |
| 6797882 | Die package for connection to a substrate | Stanford W. Crane, Jr., Charley T. Ogata | 2004-09-28 |
| 6734546 | Micro grid array semiconductor die package | Stanford W. Crane, Jr., Vicente D. Alcaria | 2004-05-11 |
| 6700138 | Modular semiconductor die package and method of manufacturing thereof | Stanford W. Crane, Jr., Jennifer Colegrove, Zsolt Horvath, Joshua G. Nickel, Lei Yang | 2004-03-02 |