Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6700138 | Modular semiconductor die package and method of manufacturing thereof | Stanford W. Crane, Jr., Jennifer Colegrove, Myoung-soo Jeon, Joshua G. Nickel, Lei Yang | 2004-03-02 |