Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818970 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-11-16 |
| 6808961 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-10-26 |
| 6686652 | Locking lead tips and die attach pad for a leadless package apparatus and method | Jaime A. Bayan, Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko +2 more | 2004-02-03 |
| 6677667 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-01-13 |