Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818970 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2004-11-16 |
| 6808961 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2004-10-26 |
| 6686652 | Locking lead tips and die attach pad for a leadless package apparatus and method | Jaime A. Bayan, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more | 2004-02-03 |
| 6677667 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2004-01-13 |
| 6674156 | Multiple row fine pitch leadless leadframe package with use of half-etch process | Jaime A. Bayan | 2004-01-06 |