Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818970 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2004-11-16 |
| 6808961 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2004-10-26 |
| 6797540 | Dap isolation process | Felix D. Li | 2004-09-28 |
| 6781243 | Leadless leadframe package substitute and stack package | Felix C. Li | 2004-08-24 |
| 6777788 | Method and structure for applying thick solder layer onto die attach pad | Sharon Ko Mei Wan | 2004-08-17 |
| 6698088 | Universal clamping mechanism | Ah Lek Hu, Sharon Mei Wan Ko, Peng Yeen Chan | 2004-03-02 |
| 6686652 | Locking lead tips and die attach pad for a leadless package apparatus and method | Peter Howard Spalding, Harry Cheng Hong Kam, Ah Lek Hu, Sharon Mei Wan Ko, Santhiran Nadarajah +2 more | 2004-02-03 |
| 6677667 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2004-01-13 |
| 6674156 | Multiple row fine pitch leadless leadframe package with use of half-etch process | Peter Howard Spalding | 2004-01-06 |