Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818970 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-11-16 |
| 6808961 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-10-26 |
| 6677667 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-01-13 |