Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818970 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-11-16 |
| 6808961 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-10-26 |
| 6777788 | Method and structure for applying thick solder layer onto die attach pad | Jaime A. Bayan | 2004-08-17 |
| 6677667 | Leadless leadframe package design that provides a greater structural integrity | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Chan Peng Yeen, Jaime A. Bayan +1 more | 2004-01-13 |