Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821864 | Method to achieve increased trench depth, independent of CD as defined by lithography | Kevin K. Chan, Subhash B. Kulkarni, Gangadhara S. Mathad | 2004-11-23 |
| 6821900 | Method for dry etching deep trenches in a substrate | Satish D. Athavale, Munir D. Naeem, Gangadhara S. Mathad | 2004-11-23 |
| 6809005 | Method to fill deep trench structures with void-free polysilicon or silicon | Gangadhara S. Mathad, Kevin K. Chan, Subhash B. Kulkarni | 2004-10-26 |
| 6768155 | Circuit with buried strap including liner | Venkatachalam C. Jaiprakash | 2004-07-27 |
| 6743727 | Method of etching high aspect ratio openings | Gangadhara S. Mathad, Siddhartha Panda | 2004-06-01 |
| 6709917 | Method to increase the etch rate and depth in high aspect ratio structure | Siddhartha Panda, Gangadhara S. Mathad | 2004-03-23 |