Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821864 | Method to achieve increased trench depth, independent of CD as defined by lithography | Kevin K. Chan, Subhash B. Kulkarni, Rajiv Ranade | 2004-11-23 |
| 6821900 | Method for dry etching deep trenches in a substrate | Satish D. Athavale, Rajiv Ranade, Munir D. Naeem | 2004-11-23 |
| 6809005 | Method to fill deep trench structures with void-free polysilicon or silicon | Rajiv Ranade, Kevin K. Chan, Subhash B. Kulkarni | 2004-10-26 |
| 6743727 | Method of etching high aspect ratio openings | Siddhartha Panda, Rajiv Ranade | 2004-06-01 |
| 6709917 | Method to increase the etch rate and depth in high aspect ratio structure | Siddhartha Panda, Rajiv Ranade | 2004-03-23 |
| 6687014 | Method for monitoring the rate of etching of a semiconductor | Shoaib Zaidi | 2004-02-03 |