SK

Subhash B. Kulkarni

IBM: 2 patents #982 of 5,464Top 20%
Infineon Technologies Ag: 1 patents #395 of 1,096Top 40%
📍 Peekskill, NY: #12 of 42 inventorsTop 30%
🗺 New York: #1,410 of 9,035 inventorsTop 20%
Overall (2004): #39,843 of 270,089Top 15%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6821864 Method to achieve increased trench depth, independent of CD as defined by lithography Kevin K. Chan, Gangadhara S. Mathad, Rajiv Ranade 2004-11-23
6809005 Method to fill deep trench structures with void-free polysilicon or silicon Rajiv Ranade, Gangadhara S. Mathad, Kevin K. Chan 2004-10-26