Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793794 | Substrate plating apparatus and method | Akihisa Hongo, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki +3 more | 2004-09-21 |
| 6787467 | Method of forming embedded copper interconnections and embedded copper interconnection structure | Hiroaki Inoue | 2004-09-07 |
| 6730596 | Method of and apparatus for forming interconnection | Akira Fukunaga, Kuniaki Horie, Takao Kato, Akihisa Hongo, Hiroshi Nagasawa | 2004-05-04 |
| 6709555 | Plating method, interconnection forming method, and apparatus for carrying out those methods | Akira Fukunaga, Hiroshi Nagasawa | 2004-03-23 |