Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793794 | Substrate plating apparatus and method | Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Kenichi Suzuki +3 more | 2004-09-21 |
| 6709563 | Copper-plating liquid, plating method and plating apparatus | Shuichi Okuyama, Ryoichi Kimizuka, Takeshi Kobayashi | 2004-03-23 |