Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800188 | Copper plating bath and plating method for substrate using the copper plating bath | Hideki Hagiwara, Ryoichi Kimizuka, Yoshitaka Terashima, Megumi Maruyama, Takashi Miyake +2 more | 2004-10-05 |
| 6743395 | Composite metallic ultrafine particles and process for producing the same | Akira Fukunaga, Kaori Kagoshima, Makiko Emoto | 2004-06-01 |
| 6740242 | Plating apparatus and method of managing plating liquid composition | Akira Fukunaga | 2004-05-25 |
| 6730400 | Ultrafine composite metal particles and method for manufacturing same | Teruo Komatsu | 2004-05-04 |
| 6730596 | Method of and apparatus for forming interconnection | Akira Fukunaga, Kuniaki Horie, Naoaki Ogure, Takao Kato, Akihisa Hongo | 2004-05-04 |
| 6709555 | Plating method, interconnection forming method, and apparatus for carrying out those methods | Naoaki Ogure, Akira Fukunaga | 2004-03-23 |