| 6828664 |
Packaging substrate with electrostatic discharge protection |
Chih-Pin Hung |
2004-12-07 |
| 6827252 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2004-12-07 |
| 6756256 |
Method for preventing burnt fuse pad from further electrical connection |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-06-29 |
| 6743707 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2004-06-01 |
| 6732912 |
Solder ball attaching process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-05-11 |
| 6723630 |
Solder ball fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2004-04-20 |
| 6720244 |
Bump fabrication method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-04-13 |
| 6716739 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2004-04-06 |
| 6713320 |
Bumping process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-03-30 |
| 6692581 |
Solder paste for fabricating bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen +5 more |
2004-02-17 |
| 6673711 |
Solder ball fabricating process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2004-01-06 |