| 6827252 |
Bump manufacturing method |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more |
2004-12-07 |
| 6819002 |
Under-ball-metallurgy layer |
William T. Chen, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang +1 more |
2004-11-16 |
| 6768332 |
Semiconductor wafer and testing method for the same |
Yueh-Lung Lin, Yao-Hsin Feng, Su Tao, Chi Cheng Pan, Kuo-Pin Yang +1 more |
2004-07-27 |
| 6756256 |
Method for preventing burnt fuse pad from further electrical connection |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2004-06-29 |
| 6743707 |
Bump fabrication process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more |
2004-06-01 |
| 6732912 |
Solder ball attaching process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2004-05-11 |
| 6723630 |
Solder ball fabrication process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more |
2004-04-20 |
| 6720244 |
Bump fabrication method |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2004-04-13 |
| 6716739 |
Bump manufacturing method |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more |
2004-04-06 |
| 6714421 |
Flip chip package substrate |
Kun-Ching Chen, Chun-Chi Lee |
2004-03-30 |
| 6713320 |
Bumping process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more |
2004-03-30 |
| 6692581 |
Solder paste for fabricating bump |
Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen, Shyh-Ing Wu +5 more |
2004-02-17 |
| 6673711 |
Solder ball fabricating process |
Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more |
2004-01-06 |