Issued Patents 2004
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822324 | Wafer-level package with a cavity and fabricating method thereof | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-11-23 |
| 6819002 | Under-ball-metallurgy layer | William T. Chen, Ho-Ming Tong, Chun-Chi Lee, Jeng-Da Wu, Chih-Huang Chang +1 more | 2004-11-16 |
| 6809852 | Microsystem package structure | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-10-26 |
| 6768207 | Multichip wafer-level package and method for manufacturing the same | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-07-27 |
| 6768332 | Semiconductor wafer and testing method for the same | Yueh-Lung Lin, Ho-Ming Tong, Yao-Hsin Feng, Chi Cheng Pan, Kuo-Pin Yang +1 more | 2004-07-27 |
| 6756256 | Method for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-06-29 |
| 6732912 | Solder ball attaching process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-05-11 |
| 6720244 | Bump fabrication method | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-04-13 |
| 6713320 | Bumping process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-03-30 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen +5 more | 2004-02-17 |
| 6693364 | Optical integrated circuit element package and process for making the same | Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-02-17 |